26.03.12

[On-Axis Confocal WiseScope]
The On-Axis Confocal WS (WiseScope) module, recently developed by SD Optics, is designed to address the growing demand for semiconductor packaging inspection. By integrating the company’s proprietary variable focus aperture technology with confocal autofocus (AF), the module achieves focus in just 0.0012 seconds and performs real-time ultra-precision metrology, providing an advanced inspection solution. This module delivers both ultra-high speed and high-precision measurement capabilities, differentiating it from solutions offered by other global inspection equipment manufacturers.   For demonstrations or technical collaboration, please feel free to contact us for further information.
>>Related News Article “By combining two core technologies, SD Optics has achieved a focus-lock speed of 0.0012 seconds with a 50× objective lens. This makes the solution suitable for applications requiring high throughput, such as high-speed line scanning, large-area packages, and wafer surface 3D metrology and inspection. It also achieves a Z-axis repeatability of 0.15 micrometers (μm). This level of performance is typically achievable only with high-precision metrology equipment rather than conventional optical inspection systems, providing consistent measurement results even when measurements are repeated along the Z-axis. It also enables real-time precision measurement of sub-micron height variations during motion in applications such as: - Through-Silicon Vias (TSV) formed in DRAM wafers for High Bandwidth Memory (HBM) - Through-Glass Vias (TGV) used as signal transmission paths in semiconductor glass substrates - micro-bumps and redistribution layers (RDL) for advanced semiconductor packaging.”
Article source: https://www.etnews.com/20260310000224  (Electronic Times, Mar. 12, 2026)

25.03.06

▲ SD Optics’ semiconductor glass substrate TGV inspection solution ‘TGV Vision Master’ inspecting a sample. A technology has emerged that can fully inspect ‘Through Glass Via (TGV)’, which is considered the most difficult process in semiconductor glass substrate manufacturing. As the introduction of glass substrates in the semiconductor industry is promoted, solutions for commercialization are being developed one after another. SD Optics announced on the 5th that it has developed ‘TGV Vision Master’, which can fully inspect TGVs using a 3D line scanner. TGVs are passages that transmit electric signals by drilling holes tens of micrometers (㎛) in size into a glass substrate and filling them with metals such as copper. In order for TGVs to function properly, the size and spacing of the holes must be uniform. In particular, there must be no deviation in the diameters of the upper and lower holes to ensure reliability. SD Optics has developed a technology to measure TGV holes in real time as a 3D shape using an optical scanner positioned vertically and diagonally on a glass substrate. The concept is to directly measure the upper and lower surfaces and inner diameter of the hole to determine whether the TGV process was performed properly. The company explained that it can precisely analyze the round shape of the hole, taper angle, and upper and lower hole position deviation, immediately identify minute deviations in the process, and manage the quality of semiconductor glass substrates through this. ▲ SD Optics inspection image. The outer diameter, inner diameter, positional accuracy, and roundness of the TGV holeson a semiconductor glass substrate were measured (Photo = SD Optics)  This type of inspection requires an optical scanner to quickly change focus, and SD Optics utilized its patented MALS technology. With MEMS technology, the MALS lens has approximately 8,000 micro mirrors inside that control the angle of light and focus in real time. This is the technology that SD Optics also supplied to the world-class optical company Carl Zeiss Germany. With this technology, SD Optics’ TGV Vision Master has achieved a scanning speed of 40mm per second. The inspection speed was an obstacle that prevented the full inspection of semiconductor glass substrates, but the company has made it possible to quickly inspect even 510mm x 515mm semiconductor glass substrates, making full inspection possible. The company also explained that it can simultaneously detect defect images such as cracks or chipping on the upper, middle, and lower surfaces of the TGV hole. Such cracks are a factor that causes semiconductor glass substrates to break due to heat and pressure during the post-process. Detecting such defects at the early stage of process helps improving the manufacturing yield. A company official said, “The repeat accuracy is at the level of 0.25㎛, which is higher than the 0.3㎛ required by the industry.” In addition, TGV Vision Master also provides an inspection function after cutting the glass substrate. The semiconductor glass substrate is cut into individual units after the Ajinomoto Build-up Film (ABF) process, an insulating film. TGV Vision Master can identify the size, thickness, substrate step, and defects of individual units after this singulation process. SD Optics will supply new solutions to customers in cooperation with Philoptics Co, Ltd., a semiconductor glass substrate processing equipment company. Philoptics plans to manufacture a turn-key inspection equipment and supply to semiconductor glass substrate manufacturers. It has secured one customer and is currently discussing a contract with global semiconductor glass substrate manufacturers. Mr. Kyoung Seok Jung, Vice President and Chief Strategy Officer (CSO) of SD Optics, emphasized, “This is the first comprehensive inspection system to be applied to actual semiconductor glass substrate production lines, providing higher efficiency and precision than existing individual inspection methods,” and “It will contribute to improving the quality of glass substrate processes and enhancing productivity.”  Issue Date: March 6, 2025News URL: https://www.etnews.com/20250305000109 

24.12.11

SD Optics 是一家专注于光学领域的企业，致力于核心技术（MALS™）的持续研发和应用扩展，提供专业的视觉检测解决方案。 响应客户需求，我司近期推出了一款新品 WiseScope Vx200 光学模组。  WiseScope Vx200 光学模组集成了 MALS™(Micromirror Array Lens System) 技术，提供视觉检测所需的基本功能。 包括实时 EDoF(Extended Depth of Field / 超景深)、All In Focus 全景对焦 2D/3D 成像、多焦点设置、焦点锁定、3D 量测功能、 能够获取更为直观的深度信息，以及剖面图在内的 3D 图像数据。特别是 WiseScope Vx200 可通过物镜转换旋座（nosepiece）兼容多种物镜，方便用户根据检查需求自由切换倍率。此外，结合一个固定倍率物镜时，可以作为独立的 3D 显微镜用于视觉检测，也可以根据需求组装到检测设备中使用。  WiseScope Vx200 光学模组的功能包括：  - 采用了 MALS™(Micromirror Array Lens System) 超高速变焦技术 - 通过 MALS™ 技术实现 EDoF（超景深）以及 3D 成像 - 可自由切换不同倍率，提供便捷性和灵活性 - 可获取实时 3D 数据和深度图 - 自动对焦、多点对焦和全景对焦功能 - 针对特定检测区域（ROI）进行自动对焦和焦点锁定 - 采用了优化后的最适照明系统 - 融合校准算法可获取更为准确的 3D 测量数据 - 结合特定物镜，可作为独立的 3D 显微镜使用 SD Optics 将持续提高核心技术竞争力，力求为客户提供最佳光学解决方案。