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Confocal AF Module

Confocal AF Module

SD Optics’ Confocal AF Module is the world’s first breakthrough solution,
seamlessly integrating ultra-high-speed variable focus technology with a
Through-the-Lens (TTL) confocal optical system.

By aligning inspection and height measurement on a single optical axis,
it delivers real-time Z-axis displacement (ΔZ) measurement with fast, precise autofocus.

With support for Extended Depth of Focus (EDoF) imaging,
it unlocks powerful image-based 3D measurement capabilities.

Engineered for performance and precision, the Confocal AF Module sets a new standard for
high-precision inspection and metrology applications.

SD Optics’ Confocal AF Module is the world’s first breakthrough solution,
seamlessly integrating ultra-high-speed variable focus technology with a
Through-the-Lens (TTL) confocal optical system.

By aligning inspection and height measurement on a single optical axis,
it delivers real-time Z-axis displacement (ΔZ) measurement with fast, precise autofocus.

With support for Extended Depth of Focus (EDoF) imaging,
it unlocks powerful image-based 3D measurement capabilities.

Engineered for performance and precision, the Confocal AF Module sets a new standard for
high-precision inspection and metrology applications.

Product Configuration & Feature

  • Through-the-Lens (TTL) confocal system
  • On-axis ΔZ measurement
  • No mechanical Z-axis movement
  • Suitable for high-grade cleanroom environments (i.e. semiconductor)
  • High repeatability and reliability
  • Auto focus & EDoF imaging
  • Image-based 3D shape measurement
  • Precise warpage correction
  • On-the-Fly (OTF) inspection

Applications

1) Inspection of Severely Warped Wafers (e.g., Fan-Out Wafers)
→ On-axis focus tracking for on-the-fly inspection
2) Fan-Out Wafer-Level Packaging (FOWLP) and Panel-Level Packaging (PLP) Inspection
→ Supports on-the-fly inspection
3) Glass Substrate Inspection
→ Detection of via hole micro-cracks and surface defects
→ High-accuracy dimensional measurement with warpage focus tracking and EDoF
Application 1

DISPLAY PANEL PARTICAL MEASUREMENT

Particles within transparent layers, which appear overlapped or blurred, making accurate height measurement difficult  precise measurement is achievable with Confocal AF Module

Application 2

EUV PELLICLE INSPECTION

Accurate inspection of EUV Pellicle even when micro-vibration or sagging of ultra-thin pellicles exceeds the optical system’s depth of field

Confocal AF Module – Key Benefits

  • Real-Time Focus Tracking: Instant, on-axis Z-axis measurement

  • Precision 3D Imaging: EDoF-powered, image-based 3D measurement

  • Distortion-Free Stability: True on-axis confocal design for reliable results

Product Specification

Magnification 10x 20x 50x
WiseScope

FOV (mm × mm) 0.84 × 0.71 0.42 × 0.36 0.168 × 0.144
Working Distance (mm) 34mm 20mm 13mm
DOF (μm) 7μm 3.1μm 1.8um
Depth Resolution (μm) 1.23um 0.26um 0.047um
Scan Range (μm) 390um 250um 30um
Confocal Autofocus Sensor

Laser source Type Laser Diode
Spec. 660 nm / 120 mW
Repeatability (μm) 0.81 0.22 0.02 0.15
Measurement Range (μm) 764.0 176.0 20.0 40.0
Measurement
Time (ms) *
Full-Range 60 30.0 5.3 11.5
10% of Range 6.0 3.0 0.5 1.2
Notes * Measurement time : Based on ½ DOF, operating cycle 4 kHz