26.03.12

[On-Axis Confocal WiseScope]
The On-Axis Confocal WS (WiseScope) module, recently developed by SD Optics, is designed to address the growing demand for semiconductor packaging inspection.By integrating the company’s proprietary variable focus aperture technology with confocal autofocus (AF), the module achieves focus in just 0.0012 seconds and performs real-time ultra-precision metrology, providing an advanced inspection solution.This module delivers both ultra-high speed and high-precision measurement capabilities, differentiating it from solutions offered by other global inspection equipment manufacturers. For demonstrations or technical collaboration, please feel free to contact us for further information.
>>Related News Article“By combining two core technologies, SD Optics has achieved a focus-lock speed of 0.0012 seconds with a 50× objective lens.This makes the solution suitable for applications requiring high throughput, such as high-speed line scanning, large-area packages, and wafer surface 3D metrology and inspection.It also achieves a Z-axis repeatability of 0.15 micrometers (μm).This level of performance is typically achievable only with high-precision metrology equipment rather than conventional optical inspection systems, providing consistent measurement results even when measurements are repeated along the Z-axis.It also enables real-time precision measurement of sub-micron height variations during motion in applications such as:- Through-Silicon Vias (TSV) formed in DRAM wafers for High Bandwidth Memory (HBM)- Through-Glass Vias (TGV) used as signal transmission paths in semiconductor glass substrates- micro-bumps and redistribution layers (RDL) for advanced semiconductor packaging.”
Article source: https://www.etnews.com/20260310000224  (Electronic Times, Mar. 12, 2026)

25.03.06

 ▲ SDOptics’ semiconductor glass substrate TGV inspection solution ‘TGV VisionMaster’ inspecting a sample.   Atechnology has emerged that can fully inspect ‘Through Glass Via (TGV)’, whichis considered the most difficult process in semiconductor glass substratemanufacturing. As the introduction of glass substrates in the semiconductorindustry is promoted, solutions for commercialization are being developed oneafter another.   SDOptics announced on the 5th that it has developed ‘TGV Vision Master’, whichcan fully inspect TGVs using a 3D line scanner.   TGVs arepassages that transmit electric signals by drilling holes tens of micrometers (㎛) in size into a glass substrate and filling them with metals suchas copper. In order for TGVs to function properly, the size and spacing of theholes must be uniform. In particular, there must be no deviation in thediameters of the upper and lower holes to ensure reliability.   SDOptics has developed a technology to measure TGV holes in real time as a 3Dshape using an optical scanner positioned vertically and diagonally on a glasssubstrate. The concept is to directly measure the upper and lower surfaces andinner diameter of the hole to determine whether the TGV process was performedproperly. The company explained that it can precisely analyze the round shapeof the hole, taper angle, and upper and lower hole position deviation,immediately identify minute deviations in the process, and manage the qualityof semiconductor glass substrates through this.   ▲ SDOptics inspection image. The outer diameter, inner diameter, positionalaccuracy, and roundness of the TGV holes on a semiconductor glass substratewere measured (Photo = SD Optics)    Thistype of inspection requires an optical scanner to quickly change focus, and SDOptics utilized its patented MALS technology. With MEMS technology, the MALSlens has approximately 8,000 micro mirrors inside that control the angle oflight and focus in real time. This is the technology that SD Optics alsosupplied to the world-class optical company Carl Zeiss Germany.   Withthis technology, SD Optics’ TGV Vision Master has achieved a scanning speed of40mm per second. The inspection speed was an obstacle that prevented the fullinspection of semiconductor glass substrates, but the company has made itpossible to quickly inspect even 510mm x 515mm semiconductor glass substrates,making full inspection possible.   Thecompany also explained that it can simultaneously detect defect images such ascracks or chipping on the upper, middle, and lower surfaces of the TGV hole.Such cracks are a factor that causes semiconductor glass substrates to breakdue to heat and pressure during the post-process. Detecting such defects at theearly stage of process helps improving the manufacturing yield. A companyofficial said, “The repeat accuracy is at the level of 0.25㎛, which is higher than the 0.3㎛ required bythe industry.”   Inaddition, TGV Vision Master also provides an inspection function after cuttingthe glass substrate. The semiconductor glass substrate is cut into individualunits after the Ajinomoto Build-up Film (ABF) process, an insulating film. TGVVision Master can identify the size, thickness, substrate step, and defects ofindividual units after this singulation process.   SDOptics will supply new solutions to customers in cooperation with PhilopticsCo, Ltd., a semiconductor glass substrate processing equipment company.Philoptics plans to manufacture a turn-key inspection equipment and supply to semiconductorglass substrate manufacturers. It has secured one customer and is currentlydiscussing a contract with global semiconductor glass substrate manufacturers.   Mr.Kyoung Seok Jung, Vice President and Chief Strategy Officer (CSO) of SD Optics,emphasized, “This is the first comprehensive inspection system to be applied toactual semiconductor glass substrate production lines, providing higherefficiency and precision than existing individual inspection methods,” and “Itwill contribute to improving the quality of glass substrate processes andenhancing productivity.”   Issue Date: March 6, 2025 News URL: https://www.etnews.com/20250305000109

24.12.11

SD Optics is a leading company in the optical field, securing a solid position in the industry through continuous technological innovation and development. Leveraging MALS™ technology, the company is accelerating the development of new products to meet industry demands and has recently launched the WiseScope Vx200 optical module.  The WiseScope Vx200 optical module integrates MALS™ (Micromirror Array Lens System) technology to provide essential features for visual inspections. These include real-time EDoF (Extended Depth of Field), All In Focus 2D/3D imaging, multi-focus settings, focus-locking functions, 3D measurements, intuitive depth map information acquisition, and 3D profile generation, including cross-sectional profiles.Notably, the WiseScope Vx200 offers flexibility in changing magnifications, thanks to its compatibility with multiple objective lenses via a nosepiece. This allows users to freely switch magnifications according to inspection needs. Additionally, it can be used as an independent microscope for visual inspections when combined with specific objective lenses and can also be integrated into inspection equipment.  The features of the WiseScope Vx200 optical module include:- High-speed focus change technology utilizing MALS™ (Micromirror Array Lens System)- EDoF (Extended Depth of Field) and 3D imaging capabilities with MALS™ technology- Convenience and flexibility in selecting objective lens magnifications- Real-time 3D and depth map generation- Auto-Focus, Multi-Focus, and All-in-Focus functions- Auto-Focus and Focus-Lock functions for specific regions of interest (ROI)- Optimized lighting system application- Accurate 3D measurements with calibration programs- Capability to build independent 3D microscopes when combined with objective lenses SD Optics continues to lead as a total solution provider in the optical vision application field. The company is committed to strengthening its influence in the optical field through ongoing innovation and development.