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[On-Axis Confocal WiseScope]

The On-Axis Confocal WS (WiseScope) module, recently developed by SD Optics, is designed to address the growing demand for semiconductor packaging inspection.

By integrating the company’s proprietary variable focus aperture technology with confocal autofocus (AF), the module achieves focus in just 0.0012 seconds and performs real-time ultra-precision metrology, providing an advanced inspection solution.

This module delivers both ultra-high speed and high-precision measurement capabilities, differentiating it from solutions offered by other global inspection equipment manufacturers.

For demonstrations or technical collaboration, please feel free to contact us for further information.

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“By combining two core technologies, SD Optics has achieved a focus-lock speed of 0.0012 seconds with a 50× objective lens.

This makes the solution suitable for applications requiring high throughput, such as high-speed line scanning, large-area packages, and wafer surface 3D metrology and inspection.

It also achieves a Z-axis repeatability of 0.15 micrometers (μm).

This level of performance is typically achievable only with high-precision metrology equipment rather than conventional optical inspection systems, providing consistent measurement results even when measurements are repeated along the Z-axis.

It also enables real-time precision measurement of sub-micron height variations during motion in applications such as:

- Through-Silicon Vias (TSV) formed in DRAM wafers for High Bandwidth Memory (HBM)

- Through-Glass Vias (TGV) used as signal transmission paths in semiconductor glass substrates

- micro-bumps and redistribution layers (RDL) for advanced semiconductor packaging.”

Article source: https://www.etnews.com/20260310000224  (Electronic Times, Mar. 12, 2026)